Sip Package Substrate
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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
Price: US 99-120 each piece
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Stack Via Sip Package Substrate, Via Filling Sip Package Substrate, BT Sip Package Substrate
stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi-functions associated with a system or sub-system in one single package. It is essential to next-generation package for ... View More
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Anylayer/Buildup types Sip packaging Substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Horexs PCB, Gold Plated RAM PCB, 0.8mm RAM PCB Board
Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mai... View More
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Sip package substrate BT material 4 layer ENEPIG
Price: US 99-120 each piece
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Custom TF Card RAM PCB, FR4 RAM PCB, BT Camera Circuit Board
Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,R... View More
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