FCCSP Package Substrate
(8)
BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... View More
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FCCSP substrate manufacture supporting China
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... View More
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Flip Chip CSP Package Substrate 5x5mm Green Color BT Material
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:CSP package substrate, 5x5mm CSP package substrate, BT FCCSP Package Substrate
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... View More
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High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... View More
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FCCSP package substrate 4L Buildup types ENEPIG
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.2mm Antenna Circuit Board, Intelligent Handwriting Antenna Circuit Board, Large 0.2mm Antenna PCB
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... View More
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semiconductor FCCSP Package Substrate manufacture
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... View More
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... View More
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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
Price: US 85-100 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... View More
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