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BGA Substrate
(25)
BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... View More
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microelectronics package substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Black Soldermask LED PCB Board, Black Soldermask led lamp pcb, LED PCB Board With total Pad
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPl... View More
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BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:MicroSD BGA Substrate, TF Memory BGA Substrate, ENEPIG BGA Substrate
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-substrate production sepc. information; 2-Gerber files(substrate designer/engineer ca... View More
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BT material semiconductor Pacakge Substrate L/S 35/35um
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT FR4 BOC Pacakge Substrate, Improved Tenting BOC Pacakge Substrate, BOC Pacakge fr4 substrate
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI... View More
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Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap plating
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.2mm Mini PCB Board, Horexs LED PCB Board, Horexs Mini PCB Board
Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsui... View More
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MicroLED/MiniLED package substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Fine Pitch Micro Pcb Board, Micro Pcb Board No Chromatism, Fine Pitch Pcb For Outdoor Led
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... View More
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ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Half Hole BGA Substrate, ENEPIG BGA Substrate, BT FR4 Package Substrate
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubi... View More
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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Wire Bond BGA Substrate, ENIG BGA Substrate, IC Packaging Substrate Board
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; M... View More
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2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:FR4 BGA Substrate, DRAM Memory Chip BGA Substrate, FCBGA Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material... View More
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BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT FR4 CSP Substrate, 4 Layer CSP Substrate, ENEPIG BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly bran... View More
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0.28mm Finished Lead Free memory chip substrate manufacture
Price: US 1.3-1.1 each piece
MOQ: 100pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Lead Free Fr4 Printed Circuit Board, 0.25mm Fr4 Printed Circuit Board, 0.25mm Lead Free Circuit Board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... View More
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BT material BGA semiconductor package Substrate production
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:FR4 Finished BGA Substrate, 1mil BGA Substrate, Customize Soldermask BGA Substrate
All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Short introduction of Horexs Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC subst... View More
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MCP package Substrate 0.5oz Copper Customize BT Material
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Immersion Gold FR4 Substrate, 0.5oz Copper MCP Substrate, MCP FR4 Substrate
MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei provinc... View More
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IC Chip Substrate Fabrication with BT(MGC/Hitachi) ENIG/Soft gold/ENEPIG
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:MCP Chip Substrate Board Fabrication, BT ENIG Substrate Board Fabrication, 0.25mm Finished BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finish... View More
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BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:4 Layer Sip Package Substrate, BT ENEPIG Sip Package Substrate, 0.29mm Finished Package Chip Substrate
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Sur... View More
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L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT Wire Bonding Substrate, 35um Line Wire Bonding Substrate, UL ENIG IC Package Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohme... View More
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FBGA Package substrate production supporting BT 40um core
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:4 Layer Flip Chip Substrate, BGA Package Chip Substrate, BT Core FCBGA Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickn... View More
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semiconductor packaging Substrate of DRAM Memory manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT FR4 Substrate Board, 35um Line Substrate Board, DRAM Memory Packaging FR4 Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-F... View More
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RF/mmwave module substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT Pcb Printed Circuit Board, 2 Layer Pcb Printed Circuit Board, BT Black Pcb Circuit Board
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-... View More
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0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.2mm Backlight Pcb, Keyboard Backlight Pcb, 0.2mm keyboard pcb board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... View More
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