IC Package Substrate
(47)eMMC IC Package Substrate PCB
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC as... View More
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Hitachi BT IC Package Substrate production supporting
Price: US 0.11-0.13 each piece
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT IC Package Substrate, FR4 Printed Circuit Board Pcb, FR4 IC Package Substrate
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... View More
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0.2mm 2 layer Memory Card substrate Fabrication For Capsulation
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.2mm Pcb Board Fabrication, Pcb Board Fabrication For Capsulation, 2 Layer Memory Card Pcb
Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Min... View More
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4layer BT material Sip Packaging Substrate Semiconductor package
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:MSAP Sip Packaging Substrate, BT Sip Packaging Substrate, 4layer CSP Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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line/space 25um FBGA Package Substrate For Memory ic packaging
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:25um FCBGA Package Substrate, BGA FCBGA Package Substrate, Automotive FCBGA Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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Hitachi brand BT material substrate manufacture
Price: US 0.1-0.12 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:IC Package Substrate Printed Circuit Board, Horexs IC Package Substrate, Complex Substrate Printed Circuit Board
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... View More
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0.15mm IC assembly package substrate For semiconductor package
Price: US 0.1-0.12 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.15mm Ultrathin Pcb, Ultrathin Pcb Printed Circuit Board Assembly, 0.15mm Printed Circuit Board Assembly
Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF... View More
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AUS308 PSR IC Package substrate manufacture
Price: US 0.086-0.1 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Black Solder mask Pasted Fr4 Board, Black Fr4 Board BAG Bonding, Solder mask Pasted Fr4 Board
Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:... View More
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0.15mm Thickness 2 Layers IC Package Substrate For memory package
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.15mm Thickness IC Package Substrate, 2 Layers IC Package Substrate, FR4 Substrate Printed Circuit Board
Memory Card PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.o... View More
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FBGA/PBGA/LGA Package Semiconductor Substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:MEMS Semiconductor Substrate Boards, CMOS Semiconductor Substrate Boards, 1mil MEMS Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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finleLine Space IC Package Substrate for Wearable and Automotive Electronics
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:FBGA IC Packaging Substrate, FR4 IC Packaging Substrate, FBGA Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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Storage IC Package Substrate Pcb
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Storage IC Package Substrate Pcb, Horexs IC Package Substrate Pcb, IC Package Substrate Horexs
Storage IC package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC packa... View More
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DDR IC Package Substrate Pcb
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:DDR IC Package Substrate Pcb, DDR IC Package Substrate, DDR IC Pcb
DDR4/LPDDR,BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Suitable for cell phone,Ipad,Set top box,Wearable electronics ,UAV. Application:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC sub... View More
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Precision 0.15mm IC Packaging Substrate fabrication
Price: US 0.1-0.12 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.15mm IC Package Substrate, 0.15mm Flexible Pcb Fabrication, IC Package Substrate Flexible Pcb Fabrication
Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF... View More
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JEDEC Standard eMCP IC Package Substrate Fabrication
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:eMCP IC Package Substrate, eMCP Pcb Board Fabrication, UL Pcb Board Fabrication
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; S... View More
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HOREXS semiconductor ic package substrate With Chip Wire Bonding
Price: Depend on customized spec.
MOQ: Sample or Mass production
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Horexs Bga Circuit Board, Ultra Thin Bga Circuit Board, Bga Circuit Board With Wire Bonding
Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ... View More
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BGA IC Package Substrate With Cap Plated MGC BT material
Price: Depend on customized spec.
MOQ: Sample or Mass production
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BGA IC Package Substrate, IC Package Substrate With Cap Plated, Horexs Printed Circuit Board
Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainl... View More
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OEM ODM Gold Bonding IC Package Substrate 4 Layer
Price: Depend on customized spec.
MOQ: Sample or Mass production
Delivery Time: 7-10 working days
Brand: Horexs
High Light:IC Package Substrate PCB 4 Layer, ODM IC Package Substrate, OEM IC Package Substrate
Application:IC substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/wi... View More
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4L build up types 0.8mm Gold Surface IC Package Substrate
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Horexs IC Package Substrate 0.8mm, Gold Surface Multilayer Pcb Board, 0.8mm IC Package Substrate
Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finishe... View More
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Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Bright Gold 0.2mm Multilayer Pcb, Horexs Multilayer Pcb, Bright Gold 0.2mm Multilayer Pcb Fabrication
Application: Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.... View More
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