IC Package Substrate
(47)
eMMC IC Package Substrate PCB
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... View More
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4layer BT material Sip Packaging Substrate Semiconductor package
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:MSAP Sip Packaging Substrate, BT Sip Packaging Substrate, 4layer CSP Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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0.2mm 2 layer Memory Card substrate Fabrication For Capsulation
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.2mm Pcb Board Fabrication, Pcb Board Fabrication For Capsulation, 2 Layer Memory Card Pcb
Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Min... View More
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Hitachi BT IC Package Substrate production supporting
Price: US 0.11-0.13 each piece
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT IC Package Substrate, FR4 Printed Circuit Board Pcb, FR4 IC Package Substrate
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... View More
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line/space 25um FBGA Package Substrate For Memory ic packaging
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:25um FCBGA Package Substrate, BGA FCBGA Package Substrate, Automotive FCBGA Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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FBGA/PBGA/LGA Package Semiconductor Substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:MEMS Semiconductor Substrate Boards, CMOS Semiconductor Substrate Boards, 1mil MEMS Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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0.15mm Thickness 2 Layers IC Package Substrate For memory package
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.15mm Thickness IC Package Substrate, 2 Layers IC Package Substrate, FR4 Substrate Printed Circuit Board
Memory Card PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.o... View More
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Hitachi brand BT material substrate manufacture
Price: US 0.1-0.12 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:IC Package Substrate Printed Circuit Board, Horexs IC Package Substrate, Complex Substrate Printed Circuit Board
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... View More
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0.15mm IC assembly package substrate For semiconductor package
Price: US 0.1-0.12 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:0.15mm Ultrathin Pcb, Ultrathin Pcb Printed Circuit Board Assembly, 0.15mm Printed Circuit Board Assembly
Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF... View More
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AUS308 PSR IC Package substrate manufacture
Price: US 0.086-0.1 each piece
MOQ: 1000pieces
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Black Solder mask Pasted Fr4 Board, Black Fr4 Board BAG Bonding, Solder mask Pasted Fr4 Board
Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:... View More
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Storage IC Package Substrate Pcb
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:Storage IC Package Substrate Pcb, Horexs IC Package Substrate Pcb, IC Package Substrate Horexs
Storage IC package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC packa... View More
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ENEPIG plating ic package substrate manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT FR4 HDI Substrate, MSAP HDI Substrate, ENIG FlipChip Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device.Semiconductor,I... View More
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NAND/FLASH Memory Ic packaging Substrate
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:FR4 Flash Memory Ic Substrate, 1mil Flash Memory Ic Substrate, Multiple Wafers Nand CSP Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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Tenting process 25um DRAM IC package Substrate BT material 4 Layer
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:DRAM IC Substrate Packaging Board, 25um IC Substrate Packaging Board, BT MSAP Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BGA IC Packaging Substrate, CSP IC Packaging Substrate, 4 Layer BT MSAP Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... View More
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BT Memory Card BGA package Substrate 6 layer Immersion Gold
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BT Memory Card BGA Substrate, FR4 Memory Card BGA Substrate, 6layer Memory Card Storage Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... View More
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Semiconductor Package Substrate 12um copper buildup types
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:HDI IC Package Substrate, MEMS IC Package Substrate, 0.5oz Copper Flipchip Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... View More
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0.26mm BT BGA IC Substrate Board manufacture
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:BGA IC Substrate Board, 0.25mm IC Substrate Board, Immersion Gold BGA Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... View More
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25um BT IC Package Substrate Soft gold plating
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:1mil BT IC Package Substrate, 0.5oz Copper IC Package Substrate, 0.25mm Thickness Module Substrate Board
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... View More
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finleLine Space IC Package Substrate for Wearable and Automotive Electronics
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Light:FBGA IC Packaging Substrate, FR4 IC Packaging Substrate, FBGA Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... View More
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