IC Bonding Machine
(6)
IC Bonding Machine
Price: Negotiable
MOQ: ≥1 pc
Delivery Time: 25~50 days
Brand: Suneast
High Light:QFN IC Bonding Machine, Multi Chip Bonding Machine, SIP IC Bonding Machine
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... View More
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Sintering Die Bonder SDB 200
Price: Negotiable
MOQ: ≥1 pc
Delivery Time: 25~50 days
Brand: Suneast
High Light:Sintering Automatic Die Bonder, Compact Die Bonder Equipment, Wafer Loading Automatic Die Bonder
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... View More
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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment
Price: Negotiable
MOQ: ≥1 pc
Delivery Time: 25~50 days
Brand: Suneast
High Light:Multilayer IC Bonding Machine, 0.25*0.25mm Die Bonder Equipment, 10*10mm Die Bonder Equipment
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... View More
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
Price: Negotiable
MOQ: ≥1 pc
Delivery Time: 25~50 days
Brand: Suneast
High Light:High Precision IC Bonding Machine, 8 Inch Wafers Die Bonders, 12 Inch Wafers Die Bonders
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... View More
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Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine
Price: Negotiable
MOQ: ≥1 pc
Delivery Time: 25~50 days
Brand: Suneast
High Light:IC Die Bonding Machine, Quick Changeover Die Bonding Machine, Supermini Chip Bonding Machine
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... View More
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
Price: Negotiable
MOQ: ≥1 pc
Delivery Time: 25~50 days
Brand: Suneast
High Light:Small Footprint IC Bonding Machine, High Speed IC Bonding Machine, Modular Platform Die Bonder Machine
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... View More
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