China Micro Communications Equipment HDI PCB Assembly Used BGA PCB Assembly or Fine Pitch Placement Advanced PCBA Board Technologies and PCB Assembly Quotation for sale
Micro Communications Equipment HDI PCB Assembly Used BGA PCB Assembly or Fine Pitch Placement Advanced PCBA Board Technologies and PCB Assembly Quotation
Price: Negotiable
MOQ: 1.0 piece
Delivery Time: Negotiable
Brand: Hemeixin
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China Communications Equipment Advanced Fine Pitch Part Placement PCBA Technologies Used Of BGA PCB Assembly With X-Ray Inspection And Low Cost PCB Assembly for sale
Communications Equipment Advanced Fine Pitch Part Placement PCBA Technologies Used Of BGA PCB Assembly With X-Ray Inspection And Low Cost PCB Assembly
Price: Negotiable
MOQ: 1.0 piece
Delivery Time: Negotiable
Brand: Hemeixin
➤ Visit Website