BIWIN Storage Technology Company Limited produces high quality flash storage and is now known in OEM/ODM, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
BIWIN's experience in manufacturing includes its complete packaging, testing, and production lines at its latest 110,000 m2 facility, BIWIN Huizhou Science and Technology Zone. This state-of-the-art facility houses all the latest production equipment for assembly, packaging, testing and mass production.
For embedded computing, we make eMMC, eMCP, ePOP, uMCP, BGA SSD, UFS, DDR, LPDDR and small capacity storage. Our Advanced Packaging can squeeze 16 layers Die into our PCIe 4.0 BGA SSD bringing full SSD functionality to a single eSSD chip. For industrial control we make fast and reliable SSDs (SATA 2.5", SATA M.2, NVMe M.2, mSATA) and memory (DDR4, DDR5, memory cards, DOM Series and more.) For consumers, BIWIN products earn top global press reviews for SATA 2.5", PCIe M.2, SATA M.2, and portable SSDs, as well as DDR4, DDR5 memories and memory cards.
From the core to the intelligent edge, BIWIN offers the wide range of flash storage that suits the world's largest industries.
