310*320mm Panel Size Panel Level QFN Low Electrical Resistance
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... View More
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310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... View More
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Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... View More
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high aspect ratio TGV Foundary Capabilities for semiconductor packaging
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... View More
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Package Suitable For Various Packaging Simulation Experiments
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... View More
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