China die bond substrate
suppliersENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
High Precision Semiconductor Packaging Equipment led Die Bonder die Bonding Machine Die Attach Die Bonder
Price: Negotiable
MOQ: 1 set/sets
Delivery Time: 5-8 days
Brand: WZ
AOI Semiconductor wire bonding inspection for die bonding machine and track design
Price: Negotiable
MOQ: 1
Delivery Time: 20 work days
Brand: MENTO
PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection
Price: can negotiate
MOQ: 1Set
Delivery Time: 30 days
Brand: UNICOMP
KDC/DC Series Precision Dispensing Controller VCM SEMICONDUCTOR CHIP DIE BOND MEMS SOLDER PASTE DISPENSING Lens Industry
Price: $1-$10000
MOQ: 1
Delivery Time: 5-60 days
Brand: MingSeal
ASM AD210 Plus PCB SMT Machine Automatic Die Bonding Machine
Price: Negotiable
MOQ: 1 unit
Delivery Time: Negotiable
Brand: ASM
0.64MM Thickness Die Cut Adhesive Tape Custom Bonds Low Surface Energy Substrates 3m vhb tapes
Price: USD 0.01~0.1 per piece
MOQ: 100 pieces
Delivery Time: 3~10 work days
Brand: 3M / PUFENG
8924W High Performance Polyurethane Adhesive It Can Bond To Various Substrates, like PVC Flooring
Price: Negotiation
MOQ: 1000 Pcs
Delivery Time: 8-12 days
Brand: Huitian
Electronic Hot Melt Adhesive Glue Plastic Substrates Bonding
Price: USD+13.5-15+KG
MOQ: 100 Kilograms
Delivery Time: 15 work days
Brand: Wuxi East Group
FPC PCB Punching Machine FR4 Substrate Cutting With Cutomized Die Tooling
Price: USD1-10000/set
MOQ: 1 set
Delivery Time: 7-15 days
Brand: Winsamrt
Strong Bonding Solid Hot Glue Pillows With Slot Die Coating
Price: Negotiable
MOQ: 1000kgs
Delivery Time: 10~14 working days after order confirmed
Brand: Jaour
High Bonding Resistance Tungsten Carbide Plate For punching dies,YG6A ,YG8,Wo,Cobalt
Price: Price varies according to the grade,weight and size
MOQ: 10 KG
Delivery Time: 10-20 Days
Brand: RI XIN
Non Bond Joining Carton Printing Machine With Slotter Die Cutter
Price: USD200000...
MOQ: 1
Delivery Time: 90 days
Brand: HS
Transparent 0.6mm Die Cut Adhesive Tape High Bonded Sponge Base 3M 4930 Material
Price: Negotiable
MOQ: USD100
Delivery Time: 8 working days
Brand: BOALV
Die Bonding, Process for Placing a Chip on a Package Substrate
Price: Negotiable
MOQ: 1.0 Sets
Delivery Time: Negotiable
Brand: TORCH
Factory semiconductor packaging equipment/LED/High precision die bonder/die bonding machine/die ties
Price: Negotiable
MOQ: 1.0 Sets
Delivery Time: Negotiable
Brand: minderpack
High Accuracy Auto Operation Full Automatic Wafer Touch Screen Use Loading Die Bonding Multi-Axis Manipulator Process Die Bonder Epoxy Stamping Machine
Price: $57,200.00(1 - 4 Sets) $34,300.00(>=5 Sets)
MOQ: 1 Set
Delivery Time: Negotiable
Brand: D-WIN
Direct bonded dbc Al2O3 substrate al2o3 substrate alumina ceramic copper for Peltier
Price: Negotiable
MOQ: 100.0 pieces
Delivery Time: Negotiable
Brand: Yuxiang
Building Material Stores Wire Manual Wire Bonding Ultrasonic Bonding To Die Wire Bond Bond Machine
Price: $4,000.00(1 - 5 sets) $3,500.00(>=6 sets)
MOQ: 1 Set
Delivery Time: Negotiable
Plexiglass steel rule dies making, acrylic substrate steel rule foam cutting dies
Price: USD35.00 - 78.00
MOQ: 1 piece, wholesale price
Delivery Time: 1-5 days
Brand: Plexiglass steel rule dies making