Wafer Dicing Machine
(5)
8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW
Price: Negotiable
MOQ: 1
Delivery Time: 8-10week days
Brand: GaNova
High Light:8 inch Wafer Dicing Machine, wafer cutting machine 260mm, Wafer Dicing Machine X Axis
DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW Process quality By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved. Process controls Auto align... View More
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0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm
Price: Negotiable
MOQ: 1
Delivery Time: 8-10week days
Brand: GaNova
High Light:0.1mm/s Wafer Dicing Machine, wafer saw machine 260mm, 600mm/s Wafer Dicing Machine
DAD3350 Wafer Dicing Machine 0.1 ～ 600mm/s X-Axis Cutting Range 260mm Improved throughput The DAD3350 achieves improvement in throughput by increasing the speed of each axis. Ease of use Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operati... View More
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Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw
Price: Negotiable
MOQ: 1
Delivery Time: 8-10week days
Brand: GaNova
High Light:2.2 kW Wafer Dicing Machine, silicon wafer cutting machine 1.8 kW, silicon wafer dicing machine
DAD3350 Wafer Dicing Machine Automatic Dicing Saw X-Axis Cutting Range 260mm Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torqu... View More
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Automatic Wafer Dicing Machine 8 Inch 250mm × 250mm 300mm
Price: Negotiable
MOQ: 1
Delivery Time: 8-10week days
Brand: GaNova
High Light:Wafer Dicing Machine 250mm × 250mm, 8 Inch wafer slicing machine, Wafer Dicing Machine 300mm
0.1 ～ 600mm/s Wafer Dicing Machine Φ8 Inch (250 mm × 250 mm, Φ300 mm User-Specified Specification) Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecti... View More
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X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw
Price: Negotiable
MOQ: 1
Delivery Time: 8-10week days
Brand: GaNova
High Light:X Axis Wafer Dicing Machine, Wafer automatic dicing saw, Wafer Dicing Machine 260mm
DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW Process controls Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to... View More
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