Panel Level Packaging Chip
(4)
310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... View More
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LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps. Specifications: Chip size 0.... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilli... View More
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