TGV Through Glass Via
(7)
high aspect ratio TGV Foundary Capabilities for semiconductor packaging
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... View More
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High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined together to make customer specific holes. The glass can be coming from different suppliers, e.g., AF32/BF33 (Schott), EAGLE XG or AGC, etc. The shape of ho... View More
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High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: The panel level PVD can be performed at both sides of the panel simultaneously. It is high efficient and time saving process. The panel sizes are varied within 300mm-600mm. Ti/Cu can be performed as the seed layers. The thickness is controlled with 0.1-2 micro meters. The uniformity in ... View More
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Glass Substrate Technology-Plating Double Side Stable And Easily Maintain
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX -plating
Description: The panel plating machine is used for plating, Plating uniformity can achieve below 10%,High aspect ratio of glass through-hole plating can be performed, AR < 10 : 1 1,All pass padding Dia .: 100 μm Cu thick .: 10 μm Glass thick .: 600μm 2,Through hole plating Dia .: 50 μm Cu thick .... View More
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12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX
Description: This product is manufactured and consist of 12 layers which top and bottom have five layers and glass core has two layers, respectively. The detailed description is shown below: Glass based chiplets Material: Glass (AF32) Glass thickness: 700 μm Unit Size: 50*50mm L/S: 15/15 μ m Layer: ... View More
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Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX
Description: As shown in the following photo, the glass core substrate (with ABF protection) is experienced for drop test (1.5m high and different angles) on the glazed ceramic floor, there is no damage happen during the drop test, it is proven that glass with ABF layer structure is more robust, and... View More
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Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX
Competitive Advantage: 1. Pass the reliability test on MSL 3/HAST/TC. 2. More reliable and consistent reliability performance. 3. X-ray, C-SAM are required to perform and pass the test. View More
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