Packaging Simulation Experiments
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Package Suitable For Various Packaging Simulation Experiments
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... View More
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