BGA Substrate

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BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG

Price: US 120-150 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... View More

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IC Package Substrate

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eMMC IC Package Substrate PCB

Price: US 120-150 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB

eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... View More

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Sip Package Substrate

(3)

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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

Price: US 99-120 each piece

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:Stack Via Sip Package Substrate, Via Filling Sip Package Substrate, BT Sip Package Substrate

stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi-functions associated with a system or sub-system in one single package. It is essential to next-generation package for ... View More

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FCCSP Package Substrate

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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

Price: US 85-100 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate

FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... View More

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Sensors Substrate

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Semiconductor sensors substrate manufacture

Price: US 0.1-0.12 each piece

MOQ: 1000pieces

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:Fingerprint Recognition PCB Board Fabrication, UL Fingerprint Recognition PCB, Fingerprint Recognition PCB For Intelligent Lock

Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki... View More

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RF Module Substrate

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RF Module substrate impedance control 4L BT material soft gold

Price: US 0.089-0.109 each piece

MOQ: 1000pieces

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:Goldfinger Fingerprint Recognition PCB, FR4 Fingerprint Recognition PCB, 0.15mm Fingerprint Recognition PCB

Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) Finished thickness:0.21mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; S... View More

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Memory Substrate

(21)

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4Layer MicroSD card substrate production

Price: US 120-150 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating

Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: ​NAND memory Flash... View More

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MEMS Substrate

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OEM ODM BT Material MEMS/CMOS Substrate Multilayer substrate manufacture

Price: US 120-150 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:OEM MEMS PCB, ODM MEMS PCB, BT Multilayer Circuit Board

Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) fini... View More

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IoT Substrate

(3)

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BGA/QFN package substrate production for IoT industry semiconductor

Price: US 0.1-0.12 each piece

MOQ: 1000pieces

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:4 Layer Camera Module PCB, Horexs Camera Module PCB, Horexs 4 Layer PCB

Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuis... View More

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Other Ultrathin Substrate

(8)

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Microelectronics IC substrate manufacture

Price: US 95-120 per square meter

MOQ: 1 square meter

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB

Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... View More

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Ultrathin Rigid PCB

(16)

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FR4 core memory ic substrate manufacture

Price: US 0.089-0.109 each piece

MOQ: 1000pieces

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board

Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: ​Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... View More

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Medical Equipment PCB

(1)

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healthcare electronics/Micro-hearing electronics pcb manufacture

Price: US 85-120 each square meter

MOQ: 10 squre meters

Delivery Time: 7-10 working days

Brand: Horexs

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High Light:0.2mm Medical Equipment PCB, Highly Intensive Medical Equipment PCB, 0.2mm Routed Circuit Board

Application:healthy electronics,Microelectronics devices,others; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Othe... View More

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